Various defects occur during different stages of tablet manufacturing, and in this article, you will learn the most commonly asked interview questions related to tablet manufacturing defects.
Q:1
What are granulation defects?
The following are the main defects observed during granulation
- Over wetting
- Under wetting
- Over drying
- Under drying
- Case hardening
- Excessive fine
- Assay issue
- Segregation
Q:2
Reasons for over-wetting?
Over-wetting during wet granulation occurs due to the following factors
- Addition of excessive solvent
- Increased kneading time
Q:3
What is case hardening?
Case hardening is a defect observed during wet granulation due to localised over-wetting, where binder is entrapped inside the wet mass, and during drying, this binder is not dried properly, resulting in sticking during the tablet compression process.
Q:4
Reasons for over-drying?
Over-drying is the main contributory factor of tablet capping and lamination, which occurs due to drying the wet mass at high temperature.
Q:5
Reason for under-drying?
Under-drying is a defect where granules are not properly dried due to low drying temperature or improper fluidization.
Q:6
Reasons for assay issues?
If mixing time is less, then due to under mixing, the assay-related issues are observed, and if mixing time is increased, then assay issues may also be observed due to segregation.
Q:7
What are tablet compression defects?
The following are the common defects observed during tablet compression
- Capping
- Lamination
- Stickin
- Picking
- Weight variation
- Rat holing
- Hardness issues
- Friability issues
Q:8
What is the difference between capping and lamination?
Capping is the tablet compression defect where the crown edges of the tablets are broken down, and lamination is the defect where the tablet separates into two or more layers.
Q:9
Reasons for tablet capping?
Tablet capping occurs due to the following main reasons
- Low moisture content
- Excessive fine
- Oversized granules
- Low binder quantity
- Over lubrication
- Improper tooling adjustment
Q:10
What is the difference between sticking and picking?
Sticking is the tablet compression defect where powder binds to the die wall or on the surface of the flat face punch, whereas in the case of picking, the powder or granules adhere to the punch surface with a logo or letters.
Q:11
Reasons for tablet sticking?
Tablet sticking defect during the compression process occurs due to the following
- High moisture content
- Excessive fine
- Rough tooling surface
Q:12
What is rat holing?
A rat hole is a tablet compression defect where the flow of powder or granules through the hopper is affected due to the binding of powder or granules with the hopper wall, due to higher moisture content.
Q:13
Reasons for weight variation defects?
Weight variation during the tablet compression process occurs due to the following reasons
- Rat holing
- Poor flow
- Excessive fine
- Blockade of the Feeder housing
- Over-sized granules
- Variable punch lengths
Q:14
What are tablet coating defects?
Common tablet coating defects are as follows
- Sticking
- Picking
- Orange peel
- Colour variation
- Weight variation
- Chipping
- Blistering
- Scuffing
Q:15
Reasons for tablet sticking during coating?
Tablet sticking during the tablet coating process occurs due to the following
- Low inlet air temperature
- Low tablet bed temperature
- High spray rate
- Less atomization pressure
- Slow pan speed
- Less exhaust opening
Q16
What is mottling?
Mottling is the defect where colour migration occurs due to the use of water-soluble dyes.
Q:17
Reasons for weight gain issues?
During the tablet coating process, weight gain issues are observed due to the following
- Excessive drying
- Higher atomization air pressure
- Higher gun-to-bed distance
- Higher exhaust opening
Q18
Reasons for tablet roughness?
Tablet roughness occurs during tablet coating due to the following
- Low tablet hardness
- Higher spray rate with increased atomization.
Q:19
Reasons for colour variation defects
Colour variation occurs due to loss of colour with exhaust air during the tablet coating process due to higher drying temperature, high exhaust opening and high spray gun to tablet bed temperature.
Q:20
Defects during tablet blistering?
The following common defects are observed during blistering
- Empty pocket
- Cuts on pockets
- Wrinkles on blisters
- Eye mark issue
- Embossing issues
- Sealing problem
Q:21
Reasons for blister leakage defect?
Blister leakage occurs due to improper sealing, which occurs due to a lower sealing temperature.
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